Condensation occurs when water vapor in the air transforms into droplets upon contact with colder surfaces. In electronic devices, this moisture buildup can lead to several major issues:
Printed circuit boards and metal connections are particularly vulnerable. Humidity promotes oxidation, degrading component performance and potentially leading to failures.
Since water is conductive, condensation can create unintended electrical pathways, causing short circuits. These incidents can permanently damage electronic components and pose safety risks.
Even without short circuits, moisture can alter the electrical properties of components, leading to erratic behavior or intermittent failures that are difficult to diagnose.
Insulating materials can absorb moisture, reducing their effectiveness and increasing the risk of electrical discharges.
Several industries are particularly affected by the harmful effects of moisture on electronic equipment:
In these sectors, moisture can cause corrosion, short circuits, and material degradation. Implementing appropriate protective measures, such as conformal coatings, sealed enclosures, and humidity control systems, is crucial for ensuring the reliability and durability of electronic devices.
Ingress Protection (IP) ratings classify the level of protection an enclosure offers against the intrusion of solid objects and liquids. For example, an IP44 rating indicates protection against solid objects larger than 1mm and water splashes from all directions.
However, even with a high IP rating, devices are not necessarily protected against internal condensation. Temperature variations can cause condensation to form inside sealed enclosures, as trapped air moisture condenses on colder surfaces.
Thus, despite meeting IPXX standards, many devices still face condensation issues in real-world conditions. It is crucial to consider additional solutions to manage internal humidity, such as moisture-absorbing materials or humidity-regulating devices.
To enhance protection against moisture and condensation, it is essential to adopt effective solutions. Here are some recommended approaches:
Protective Coatings – Applying conformal coatings on printed circuit boards acts as a barrier against moisture. These thin films conform to the shape of electronic boards, shielding components from humid and corrosive environments.
Sealed Enclosures – IPXX certified enclosures prevent material & liquid infiltration into devices. These casings are especially designed to withstand liquid ingression in humid environments, ensuring protection for internal components but are not optimized for condensation hazards.
Humidity Regulation Solutions – Devices like Air Sponge offer an innovative approach to controlling moisture in confined spaces. Made from patented mesoporous materials, Air Sponge absorbs excess humidity during peaks and releases it when levels drop, preventing condensation and mold formation.
Equipment with embedded electronics must withstand extreme environments, including fluctuating humidity levels, to ensure mission safety and efficiency.
By integrating Air Sponge into your electronic devices, you add an extra layer of security by efficiently regulating internal humidity. This reduces the risks of corrosion, short circuits, and moisture-related failures, ultimately extending the lifespan and reliability of your equipment.
Air sponge product
So Sponge revolutionizes humidity regulation with eco-friendly solutions. Using patented mesoporous materials, it controls moisture, preventing condensation, mold, and corrosion. Durable and maintenance-free, So Sponge reduces energy consumption while protecting goods in transport and storage.
